8.1 Allowable touch voltage 8.2 Allowable step voltage 8.3 Reduction factors (e.g., crushed rock surface layer)
5.1 Design parameters 5.2 Fault current considerations 5.3 Fault duration 5.4 Soil resistivity 5.5 Resistivity measurement techniques (Wenner four-pin method) 5.6 Crushed rock surface layer resistivity ieee std 80 2013
7.1 Conductor material and corrosion 7.2 Thermal capacity 7.3 Mechanical strength 7.4 Conductor size calculations (based on fusion temperature) ieee std 80 2013
9.1 Preliminary grid design 9.2 Resistance of grounding grid 9.3 Maximum grid current (I G ) 9.4 Mesh voltage (E m ) calculation (Sverak's method) 9.5 Step voltage (E s ) calculation 9.6 Voltage gradient distribution 9.7 Refinement of grid design (iterative process) ieee std 80 2013
4.1 Objectives of grounding 4.2 Tolerable body current limits 4.3 Effect of frequency on body impedance 4.4 Criteria for tolerable touch and step voltages
13.1 Acceptance tests 13.2 Periodic testing 13.3 Ground resistance measurement (fall-of-potential method)